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FR1K - 1.0A SURFACE MOUNT FAST RECOVERY RECTIFIER

Download the FR1K datasheet PDF. This datasheet also covers the FR1A variant, as both devices belong to the same 1.0a surface mount fast recovery rectifier family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Fast switching for high efficiency.
  • Low leakage current.
  • High forward surge capability.
  • Solder dip 260 °C, 40 s.
  • Component in accordance to RoHS 2002/95/EC and.
  • WEEE 2002/96/EC.
  • Glass passivated chip junction.
  • This is a Pb - Free device.
  • All SMC parts are traceable to the wafer lot.
  • Additional testing can be offered upon request Circuit Diagram Mechanical Data.
  • Case: JEDEC DO-214AC molded plastic body over passivated chip.
  • Terminals:.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (FR1A-SMCDiode.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number FR1K
Manufacturer SMC Diode
File Size 317.81 KB
Description 1.0A SURFACE MOUNT FAST RECOVERY RECTIFIER
Datasheet download datasheet FR1K Datasheet

📁 Similar Datasheet

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FR1K SURFACE MOUNT FAST SWITCHENG RECTIFIER CHENG-YI
FR1K SURFACE MOUNT FAST RECOVERY RECTIFIER HITANO
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Other Datasheets by SMC Diode

Part Number Description
FR1A 1.0A SURFACE MOUNT FAST RECOVERY RECTIFIER
FR1B 1.0A SURFACE MOUNT FAST RECOVERY RECTIFIER
FR1D 1.0A SURFACE MOUNT FAST RECOVERY RECTIFIER
FR1G 1.0A SURFACE MOUNT FAST RECOVERY RECTIFIER
FR1J 1.0A SURFACE MOUNT FAST RECOVERY RECTIFIER

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
FR1A-FR1M Technical Data Data Sheet N0438, Rev. B FR1A-FR1M 1.0A SURFACE MOUNT FAST RECOVERY RECTIFIER SMA Features  Fast switching for high efficiency  Low leakage current  High forward surge capability  Solder dip 260 °C, 40 s  Component in accordance to RoHS 2002/95/EC and  WEEE 2002/96/EC  Glass passivated chip junction  This is a Pb - Free device  All SMC parts are traceable to the wafer lot  Additional testing can be offered upon request Circuit Diagram Mechanical Data  Case: JEDEC DO-214AC molded plastic body over passivated chip  Terminals: Solder plated, solderable per MIL-STD-750, Method 2026  Polarity: Color band denotes cathode end  Mounting Position: Any  Weight: 0.