MBR3060CTP
Features
:
- 150 °C TJ operation
- Center tap configuration
- Low forward voltage drop
- High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
- High frequency operation
- Guard ring for enhanced ruggedness and long term reliability
- This is a Pb
- Free Device
- All SMC parts are traceable to the wafer lot
- Additional testing can be offered upon request
Mechanical Dimensions: In mm
Symbol
A A1 A2 b b1 c D D1 E e e1 H1 L L1 ΦP Q Θ1 Θ2 Θ3
Dimensions in millimeters
Min Typical Max
14.94 15.24 15.54
10.01 10.16...
