Part AM41DL3208G
Description Stacked Multi-Chip Package (MCP) Flash Memory/SRAM
Manufacturer SPANSION
Size 1.70 MB
SPANSION

AM41DL3208G Overview

Key Specifications

Package: FBGA
Max Operating Temp: 85 °C
Min Operating Temp: -40 °C

Key Features

  • Access time as fast as 70 ns
  • 10 mA active read current at 5 MHz
  • 200 nA in standby or automatic sleep mode I Minimum 1 million write cycles guaranteed per sector I 20 Year data retention at 125°C
  • Reliable operation for the life of the system I Package
  • 73-Ball FBGA I Operating Temperature

Price & Availability

Seller Inventory Price Breaks Buy
No distributor offers were returned for this part.