EMIF08-VID01C2 Datasheet | STMicroelectronics

Description The EMIF08-VID01C2 is an 8 line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The flip chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15k V. Coated flip chip package Pin configuration (Bumps side) Benefits - - - - - - - - - 12 11 10 I8 G ND GND 9 8 7 I6 G ND GND 6 5 4 I4 G ND GND 3 2 1 I2 G ND GND High efficiency EMI filter (-33 d B @ 900 Mhz) Low line capacitance suitable for high speed data bus Low serial resistance for camera impedance adaptation Optimized PCB space consuming: 1.29 mm x 3.92 mm Very thin package: 0.695 mm Coating resin on back side and lead free package High efficiency in ESD suppression on inputs pins (IEC61000-4-2 level 4). High reliability offered by monolithic integration High reducing of parasitic elements through integration & wafer level packaging. I7 I5 I3 I1 O8 O7 O6 O5 O4 O3 O2 O1 plies with following standards: IEC61000-4-2 level 4 input pins level 1 output pins 15 k V 8 k V 2 k V 2 k V (air discharge) (contact discharge (air discharge) (contact discharge MIL STD 883E - Method 3015-6 Class 3 August 2005 Rev 2 1/6 .st. 6 .. 1 Electrical characteristics (Tamb = 25°C) Figure...