DESCRIPTION
PIN CONFIGURATION (D-PAK) TO-252 TO-251 FEATURE 100V/ 10A, RDS(ON) = 140mΩ @VGS = 10V Super high density cell design for extremely low RDS(ON) Exceptional on-resistance and maximum DC current capability TO-252,TO-251 package design PART MARKING Y: Year Code A: Process Code STANSON TECHNOLOGY 120 Bentley Square, Mountain View, Ca 94040 USA Copyright © 2009, Stanson Corp. ST16N10 2009. V1 ST16N10 N Channel Enhancement Mode MOSFET 16.0A ABSOULTE MAXIMUM RATINGS
(Ta = 25℃ Unless otherwise noted ) Parameter Symbol Drain-Source Voltage VDSS Gate-Source Voltage VGSS Continuous Drain Current (TJ=150℃) TA=25℃ TA=100℃ ID Pulsed Drain Current IDM Continuous Source Current (Diode Conduction) IS Power Dissipation TA=25℃ PD Operation Junction Temperature TJ Storgae Temperature Range TSTG Thermal Resistance-Junction to Ambient RθJA Typical 100 ±20 16.0 12.0 60 16 79 150 -55/150 110 Unit V V A A A W ℃ ℃ ℃/W STANSON TECHNOLOGY 120 Bentley Square, Mountain View, Ca 94040 USA Copyright © 2009, Stanson Corp.