Datasheet Details
| Part number | FBGA-SD |
|---|---|
| Manufacturer | STATS ChipPAC |
| File Size | 589.36 KB |
| Description | Fine Pitch Ball Grid Array |
| Datasheet |
 FBGA-SD Datasheet
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General Description
STATS ChipPAC’s Fine Pitch Ball Grid Array Stacked Die (FBGA-SD) offering includes LFBGA-SD, TFBGA-SD, VFBGA-SD and WFBGA-SD packages.
Tape versions of VFBGA-SD and TFBGA-SD are also available.
STATS ChipPAC’s chip stack technology offers the flexibility of stacking 2 to 7 die in a single package.
Key Features
- 2 die to 7 die stack with spacer capability.
- 5 x 5mm to 23 x 23mm body size.
- Package height at 1.0, 1.2, 1.4 and 1.7mm max.
- Flexible die stacking options (“pyramid,” “same die,” etc. ).
- 0.5mm to 1.0mm ball pitch, Eutectic and Lead-free solder ball.
- Flash/SRAM/PSRAM/Logic/Analog combinations.
- JEDEC standard package outlines.
- Die thinning to 75um (3mils) capability.
- Low loop wire bonding; reverse and die to die.