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FBGA-SD - Fine Pitch Ball Grid Array

Description

STATS ChipPAC’s Fine Pitch Ball Grid Array Stacked Die (FBGA-SD) offering includes LFBGA-SD, TFBGA-SD, VFBGA-SD and WFBGA-SD packages.

Tape versions of VFBGA-SD and TFBGA-SD are also available.

STATS ChipPAC’s chip stack technology offers the flexibility of stacking 2 to 7 die in a single package.

Features

  • 2 die to 7 die stack with spacer capability.
  • 5 x 5mm to 23 x 23mm body size.
  • Package height at 1.0, 1.2, 1.4 and 1.7mm max.
  • Flexible die stacking options (“pyramid,” “same die,” etc. ).
  • 0.5mm to 1.0mm ball pitch, Eutectic and Lead-free solder ball.
  • Flash/SRAM/PSRAM/Logic/Analog combinations.
  • JEDEC standard package outlines.
  • Die thinning to 75um (3mils) capability.
  • Low loop wire bonding; reverse and die to die.

📥 Download Datasheet

Datasheet preview – FBGA-SD

Datasheet Details

Part number FBGA-SD
Manufacturer STATS ChipPAC
File Size 589.36 KB
Description Fine Pitch Ball Grid Array
Datasheet download datasheet FBGA-SD Datasheet
Additional preview pages of the FBGA-SD datasheet.

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Full PDF Text Transcription

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www.DataSheet4U.com FBGA-SD Fine Pitch Ball Grid Array - Stacked Die • FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing flexibility • FBGA-T-SD: Single metal layer tape based substrate with dense routing & good electrical performance • Available in 1.4mm (LFBGA-SD), 1.2mm (TFBGASD/TFBGA-T-SD), 1.0mm (VFBGA-SD/VFBGA-TSD) & 0.80mm (WFBGA-SD) maximum package thickness • Stacking of die allows for more functionality in an array molded, cost effective, space saving package solution FEATURES • 2 die to 7 die stack with spacer capability • 5 x 5mm to 23 x 23mm body size • Package height at 1.0, 1.2, 1.4 and 1.7mm max. • Flexible die stacking options (“pyramid,” “same die,” etc.) • 0.5mm to 1.
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