A2F12M12W2-F1 Description
This ACEPACK 2 power module in fourpack topology integrates advanced silicon carbide Power MOSFET technology from STMicroelectronics. The module leverages the innovative properties of the wide-bandgap SiC material and a high-thermalperformance substrate. The result is exceptionally low on-resistance per unit area and excellent switching performance that is virtually independent of temperature.
A2F12M12W2-F1 Key Features
- Fourpack topology
- ACEPACK 2 power module
- 13 mΩ of typical RDS(on) each switch
- Insulation voltage UL certified of 2.5 kVrms
- Integrated NTC temperature sensor
- DBC Cu-Al2O3-Cu based
- Press-fit contact pins