APPLICATIONS
. . . . . . . . REFRACTORY/GOLD METALL IZATION EMITTER SITE BALLASTED 10:1 VSWR CAPABILITY LOW THERMAL RESISTANCE INPUT/OUTPUT MATCHING OVERLAY GEOMETRY METAL/CERAMIC HERMETIC PACKAGE POUT = 1.0 W MIN. WITH 5.2 dB GAIN .400 x .400 2NLF L (S042) hermetically sealed O RDER CODE AM83135-001 BRANDING 83135-1 DESCRIPTION
Low RF thermal resistance, refractory/gold metallization, and automatic wire bonding techniques ensure high reliability and product consistency. Collector 2. Base 3. Emitter 4. Base Value Un it PDISS IC VCC TJ TSTG Power Dissipation* Device Current* (TC ≤100 °C) 11.5 0.45 34 250 − 65 to +200 W A V °C °C Collector-Supply Voltage* Junction Temperature (Pulsed RF Operation) Storage Temperature THERMAL DATA Junction-Case Thermal Resistance* RTH(j-c) *Applies only to rated RF amplifier operation 13.0 °C/W February 3, 1997 1/5 AM83135-001 ELECTRICAL SPECIFICATIONS
(T case = 25° C) STATIC Symb ol Test Con ditio ns Value Min. T yp. Max. Unit BVCBO BVEBO BVCER ICES hFE...