BF3506TV Datasheet | STMicroelectronics

FULL 50-60Hz RECTIFICATION BRIDGE MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM VF (max) 35A 600V 1.3V PRELIMINARY DATASHEET + . . . Features AND BENEFITS PACT ISOTOP DESIGN PATIBLE WITH FAST DIODES, TRANSISTORS AND PASSIVE PONENTS. EXCELLENT THERMAL TRANSFER JUNCTION TI HEATSINK UL PENDING - + - DESCRIPTION The Bridges series from SGS-THOMSON has been designed to allow a better standardization of packages on boards principally designed with ISOTOP packages. The insulated package of the bridge will be able to sit on heatsink with other ponents. Single phase and 3-phase high power SMPS, UPS, MOTOR DRIVES and WELDING equipment will primarily find advantage in these industry package products. Screw version ISOTOP™ (Plastic) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (per diode unless specified) Symbol VRRM VRSM IF(AV) total IFSM I2.t Tstg Tj Pmax total Parameter Repetitive peak reverse voltage Non repetitive peak reverse voltage Average forward current Surge non repetitive forward current 50Hz JEDEC method Fusing Storage temperature range Max. operating junction temperature Total power dissipation Tc=80°C Sinus Value 600 600 35 300 660 - 65 to + 150 150 50 Unit V V A A A2.s °C °C W TM : ISOTOP is a trademark of SGS-THOMSON Microelectronics. November 1995 Ed : 1 1/3 THERMAL RESISTANCE Symbol Rth (j-c) total Junction to case Parameter Value 0.5 Unit °C/W ELECTRICAL CHARACTERISTICS (Per diode) STATIC CHARACTERISTICS Symbol IR - Parameter Reverse leakage current Test Conditions VR = 0.8 VRRM δ < 2% tp = 5ms IF = 35 A δ < 2% tp = 380µs Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Min. Typ. Max. 10 0.2 1.4 1.3 Unit µA m A V V - - Forward voltage drop Pulse test : - tp = 5 ms, duty cycle < 2 % - - tp = 380 µs, duty cycle < 2 % For one diode: Pcond = 1.02 x IF(AV) + 0.008 x I2F(RMS) and Tj = Pcond x 4 x Rth(j-c) + Tc 2/3 PACKAGE DATA (millimeter) ISOTOP (Plastic) REF. Min. M G / J O O B A DIMENSIONS Millimeters Max. 12.20...