Datasheet Summary
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Single line IPAD™, EMI filter and ESD protection
Features
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EMI symmetrical (I/O) low-pass filter High efficiency EMI filtering Lead-free package 400 µm pitch Very low PCB space occupation: 0.6 mm2 Very thin package: 0.6 mm High reliability offered by monolithic integration Reduction of parasitic elements through CSP integration Figure 1. Pin configuration (bump side)
Flip Chip (4 bumps)
B 1 2 plies with the following standards
- IEC 61000-4-2 level 4 on internal and external pins:
- 15 kV (air discharge)
- 8 kV (contact discharge) MIL STD 883F
- Method 3015.7 Class 3
- Pin A1 A2
Description TV OUT internal GND
Pin B1...