Description
TV OUT internal GND
Pin B1 B2
Description TV OUT external GND
Application
Figure 2.
Features
- EMI symmetrical (I/O) low-pass filter High efficiency EMI filtering Lead-free package 400 µm pitch Very low PCB space occupation: 0.6 mm2 Very thin package: 0.6 mm High reliability offered by monolithic integration Reduction of parasitic elements through CSP integration Figure 1. Pin configuration (bump side)
Flip Chip (4 bumps)
A
B 1 2
Complies with the following standards.
- IEC 61000-4-2 level 4 on internal and external pins:.
- 1.
EMIF01-TV01F3 Datasheet
