STMicroelectronics EMIF01-TV01F3
The EMIF01-TV01F3 is a highly integrated array designed to suppress EMI/RFI noise and provide impedance matching for mobile phone and portable applications. The EMIF01-TV01F3 is in a Flip Chip package to offer space saving and high RF performance. This low pass filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV.FEATURES
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● EMI symmetrical (I/O) low-pass filter High efficiency EMI filtering Lead-free package 400 µm pitch Very low PCB space occupation: 0.6 mm2 Very thin package: 0.6 mm High reliability offered by monolithic integration Reduction of parasitic elements through CSP integration Figure 1. Pin configuration (bump side) Flip Chip (4 bumps) A B 1 2 Complies with the following standards
● IEC 61000-4-2 level 4 on internal and external pins: – 15 kV (air discharge) – 8 kV (contact discharge) MIL STD 883F - Method 3015.7 Class 3
● Pin A1 A2
DESCRIPTION
TV OUT internal GND Pin B1 B2DESCRIPTION
TV OUT external GND Application● TV analog signal in TV_OUT interface Figure 2. Device configuration R TV out External B1
DESCRIPTION
TV out Internal A1 GND GND TM: IPAD is a trademark of STMicroelectronics. April 2008 Rev 2 1/8 8 Characteristics EMIF01-TV01F3 1 Characteristics Table 1. Symbol Absolute maximum ratings Parameter and test conditions Internal pins (A1) and external pin (B...