EMIF02-AV01F3 Overview
Key Specifications
Package: FCBGA
Mount Type: Surface Mount
Height: 605 µm
Length: 1.31 mm
Description
The EMIF02-AV01F3 is a highly integrated array designed to suppress EMI / RFI noise and provide impedance matching for mobile phones and portable applications. The EMIF02-AV01F3 is in Flip-Chip package to offer space saving and high RF performance.
Key Features
- High-density capacitor
- EMI low-pass filter and ESD protection
- High-efficiency in EMI filtering
- Lead-free package
- 400 µm pitch
