STMicroelectronics EMIF02-AV01F3
The EMIF02-AV01F3 is a highly integrated array designed to suppress EMI / RFI noise and provide impedance matching for mobile phones and portable applications. The EMIF02-AV01F3 is in Flip-Chip package to offer space saving and high RF performance.| Part No. | EMIF02-AV01F3 |
|---|---|
| Datasheet | EMIF02-AV01F3 Download |
| Manufacturer |  STMicroelectronics |
| Description | EMI filter and ESD protection |
| Buy | Stock & Price |
FEATURES
● High-density capacitor● EMI low-pass filter and ESD protection
● High-efficiency in EMI filtering
● Lead-free package
● 400 µm pitch
● Very small PCB footprint: 0.77 mm x 1.17 mm
● Very thin package: 0.605 mm
● High reliability offered by monolithic integration
● Reduction of parasitic elements thanks to CSP integration Complies with the following standards
● IEC 61000-4-2 level 4 on external pin (A2, C2) – 15 kV (air discharge) – 8 kV (contact discharge)
● IEC 61000-4-2 level 1 on internal pin (A1, C1) – 2 kV (air discharge) – 2 kV (contact discharge) Application
● Dual audio and video line interface protection and filtering in mobile phones
DESCRIPTION
Additionally, this low-pass filter includes an ESD protection circuitry to prevent damage to the application when subjected to ESD surges up to 15 kV. Flip Chip 5 bumps Figure 1. Pin configuration (bump side view) 12 A B C Figure 2. Schematic R A1 2 kV B2 Gnd 2 kV C1 15 kV 15 kV R A2 C C C2 TM: IPAD is a trademark of STMicroelectronics.
