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EMIF04-EAR01F2 - EMI filter and ESD protection

Datasheet Summary

Description

The EMIF04-EAR01F2 is a 4-line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference.

The EMIF04 Flip Chip packaging means the package size is equal to the die size.

Features

  • EMI (I/O) low-pass filter High efficiency in EMI filtering High density capacitor Very low PCB space occupation: 1.92 x 1.42 mm² Very thin package: 0.65 mm High efficiency in ESD suppression on external pins (IEC 61000-4-2 level 4) High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1. Flip Chip (11 bumps) Pin configuration (bump side) 1 I1 I2 I3 I4 2 GND.

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Datasheet Details

Part number EMIF04-EAR01F2
Manufacturer STMicroelectronics
File Size 224.56 KB
Description EMI filter and ESD protection
Datasheet download datasheet EMIF04-EAR01F2 Datasheet
Additional preview pages of the EMIF04-EAR01F2 datasheet.

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Full PDF Text Transcription

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EMIF04-EAR01F2 www.datasheet4u.com 4-line IPAD™, EMI filter and ESD protection Features ■ ■ ■ ■ ■ ■ ■ ■ EMI (I/O) low-pass filter High efficiency in EMI filtering High density capacitor Very low PCB space occupation: 1.92 x 1.42 mm² Very thin package: 0.65 mm High efficiency in ESD suppression on external pins (IEC 61000-4-2 level 4) High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1.
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