EMIF04-EAR01F2 Overview
Key Specifications
Package: SMD/SMT
Mount Type: Surface Mount
Height: 650 µm
Length: 1.92 mm
Description
The EMIF04-EAR01F2 is a 4-line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF04 Flip Chip packaging means the package size is equal to the die size.
Key Features
- Flip Chip (11 bumps)
