EMIF07-LCD02F3 Overview
Key Specifications
Package: SMD/SMT
Mount Type: Surface Mount
Height: 605 µm
Length: 1.94 mm
Description
The EMIF07-LCD02F3 is a 7-line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF07 Flip Chip packaging means the package size is equal to the die size.
Key Features
- 5 O1 Flip Chip (18 bumps) Pin layout (bump side) 4 O2 3 GND 2 I1 1 I2 I3 Complies with the following standards
- A B C D IEC61000-4-2 level 4 on inputs and outputs: – 15 kV (air discharge) – 8 kV (contact discharge) MIL STD 883E
