DESCRIPTION
The decrease in operating power allows either a reduction of the size of the battery or an increase in the time between battery recharges. The FDIP32W (window ceramic frit-seal package) has a transparent lid which allows the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. For application where the content is programmed only one time and erasure is not required, the M27W101 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages. VCC VPP 17 A0-A16 8 Q0-Q7 P E G M27W101 VSS AI01587 April 2000 1/15 M27W101 Figure 2A. DIP Connections Figure 2B. LCC Connections VPP A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 VSS 1 32 2 31 3 30 4 29 5 28 6 27 7 26 8 25 M27W101 9 24 10 23 11 22 12 21 13 20 14 19 15 18 16 17 AI02674 VCC P NC A14 A13 A8 A9 A11 G A10 E Q7 Q6 Q5 Q4 Q3 A7 A6 A5 A4 A3 A2 A1 A0 Q0 A12 A15 A16 VPP VCC P NC 1 32 A14 A13 A8 A9 A11 G A10 E Q7 9 M27W101 25 17 VSS Q3 Q4 Q5 Q6 AI01588 Figure 2C.
STMicroelectronics
