DESCRIPTION
The decrease in operating power allows either a reduction of the size of the battery or an increase in the time between battery recharges. The FDIP40W (window ceramic frit-seal package) has a transparent lids which allow the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. For applications where the content is programmed only one time and erasure is not required, the M27W402 is offered in PDIP40, PLCC44 and TSOP40 (10 x 20 mm) packages. VCC VPP 18 A0-A17 16 Q0-Q15 E G M27W402 VSS AI01863 March 2000 1/15 M27W402 Figure 2A. DIP Connections VPP E Q15 Q14 Q13 Q12 Q11 Q10 Q9 Q8 VSS Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 G 1 40 2 39 3 38 4 37 5 36 6 35 7 34 8 33 9 32 10 31 M27W402 11 30 12 29 13 28 14 27 15 26 16 25 17 24 18 23 19 22 20 21 AI02672 Figure 2B. LCC Connections VCC A17 A16 A15 A14 A13 A12 A11 A10 A9 VSS A8 A7 A6 A5 A4 A3 A2 A1 A0 Q12 Q11 Q10 Q9 Q8 VSS NC Q7 Q6 Q5 Q4 Q13 Q14 Q15 E VPP NC VCC A17 A16 A15 A14 1 44 A13 A12 A11 A10 A9 VSS NC A8 A7 A6 A5 12 M27W402 34 23 Q3 Q2 Q1 Q0 G NC A0 A1 A2 A3 A4 AI01865 Figure 2C.
STMicroelectronics
