STMicroelectronics MPXC2011DT1
The MPXC2011DT1 pressure sensor has been designed for medical usage by combining the performance of ST's shear stress pressure sensor design and the use of biomedically approved materials. It can be sterilized using ethylene oxide. The portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating.| Part No. | MPXC2011DT1 |
|---|---|
| Datasheet | MPXC2011DT1 Download |
| Manufacturer |  STMicroelectronics |
| Description | compensated pressure sensor |
| Buy | Stock & Price |
FEATURES
● Integrated temperature compensation and calibration● Ratiometric to supply voltage
● Polysulfone case material (ISO 10993)
● Provided in easy-to-use tape and reel
APPLICATIONS
● Respiratory diagnostics● Air movement control
● Controllers
● Pressure switching
DESCRIPTION
STMicroelectronics has developed a high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while providing an economic solution for the designer. This new chip carrier package uses STMicroelectronics unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration. Note: The die and wire bonds are exposed on the front side of the chip pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices during all processes.
