ST6G3244ME Description
5 Functional description . 10 DC and AC parameters . 11 Passive integration and low-pass EMI filter.
ST6G3244ME Key Features
- SD Specification Part 1 Physical Layer Specification 3.00 (SDR12, SDR25, DDR50)
- SD Specification Part 1 Physical Layer Specification 2.00 Bi-directional with direction control pin Balanced propagation
- VCCA = 1.62 V to 1.98 V
- VBAT = 3.0 V to 5.0 V Latch-up performance exceeds 100 mA (JEDEC Standard 78) ESD protection for card side (B-port, CD a
- ±8 kV contact discharge (IEC61000-4-2)
- ±15 kV air-gap discharge (IEC61000-4-2) ESD protection for host side (A-side)
- ±2 kV HBM (JEDEC 22-A114)
- ±200 V MM (JEDEC 22-A115)
- Flip Chip 25
- Operating temperature range -40 °C to +85 °C Space-saving Flip Chip 25 package (2 x 2 x 0.605 mm, 0.4 mm bump pitch) RoH