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STGB50H65FB2 - IGBT

Description

The newest IGBT 650 V HB2 series represents an evolution of the advanced proprietary trench gate field-stop structure.

Features

  • Maximum junction temperature: TJ = 175 °C.
  • Low VCE(sat) = 1.55 V(typ. ) @ IC = 50 A.
  • Minimized tail current.
  • Tight parameter distribution.
  • Low thermal resistance.
  • Positive VCE(sat) temperature coefficient C(2, TAB) G(1).

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STGB50H65FB2 Datasheet Trench gate field-stop, 650 V, 50 A, high-speed HB2 series IGBT in a D2PAK package TAB 2 3 1 D²PAK Features • Maximum junction temperature: TJ = 175 °C • Low VCE(sat) = 1.55 V(typ.) @ IC = 50 A • Minimized tail current • Tight parameter distribution • Low thermal resistance • Positive VCE(sat) temperature coefficient C(2, TAB) G(1) Applications • Welding • Power factor correction • UPS • Solar inverters • Chargers Description E(3) The newest IGBT 650 V HB2 series represents an evolution of the advanced proprietary trench gate field-stop structure. The performance of the HB2 series is G1C2TE3 optimized in terms of conduction, thanks to a better VCE(sat) behavior at low current values, as well as in terms of reduced switching energy.
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