STMicroelectronics STV160NF02L
The STV160NF02L represents the second generation of Application Specific STMicroelectronics well established STripFET™ process based on a very unique strip layout design. The resulting MOSFET shows unrivalled high packing density with ultra low on-resistance and superior switching charactestics. This device is particularly suitable for high current, low voltage switching application where efficiency is crucial.DESCRIPTION
Process simplification also translates into improved manufacturing reproducibility.APPLICATIONS
BUCK CONVERTERS IN HIGH PERFORMACE TELECOM AND VRMs DC-DC CONVERTERS CONNECTION DIAGRAM (TOP VIEW) sABSOLUTE MAXIMUM RATINGS
Symb ol V DS V DGR VGS I D (* * ) ID I DM (● ) P tot T st g Tj Parameter Drain-source Voltage (VGS = 0) Drain- gate Voltage (R GS = 20 kΩ ) Gate-source Voltage Drain Current (continuous) at Tc = 25 C Drain Current (continuous) at Tc = 100 o C Drain Current (pulsed) T otal Dissipation at Tc = 25 o C Derating F actor Storage Temperature Max. Operating Junction T emperature o Value 20 20 ± 20 160 113 640 160 1.07 -65 to 175 175 Unit V V V A A A W W /o C o C o C (●) Pulse width limited by safe operating area ( **) Limited only maximum junction temperature allowed by PowerSO-10 June 1999 1/8 STV160NF02L THERMAL DATA R thj -case R thj -amb Tl Thermal Resistance Junction-case Thermal Resistance Junction-ambient Maximum Lead Temperature F or Soldering Purpose Ma...