• Part: K5D5657ACM-F015
  • Manufacturer: Samsung Electronics
  • Size: 1.27 MB
Download K5D5657ACM-F015 Datasheet PDF
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K5D5657ACM-F015 Key Features

  • Operating Temperature : -25°C ~ 85°C
  • Package : 107-ball FBGA Type
  • 10.5x13mm, 0.8mm pitch <NAND>
  • Power Supply Voltage : 1.7~1.95V
  • Organization
  • Memory Cell Array : (32M + 1024K)bit x 8bit
  • Data Register : (512 + 16)bit x 8bit
  • Automatic Program and Erase
  • Page Program : (512 + 16)Byte
  • Block Erase : (16K + 512)Byte

K5D5657ACM-F015 Description

History 0.0 Initial issue. Draft Date May Remark 12, 2003 Preliminary 0.1 <NAND Flash> .... ver 2.6 - Added the new definition of the number of invalid blocks.