K5D5657DCM-F015 Datasheet (MCP / 256Mb NAND and 256Mb Mobile SDRAM)

Part: K5D5657DCM-F015
Manufacturer: Samsung Electronics
Size: 1.26 MB

K5D5657DCM-F015 Key Features

Operating Temperature : -25°C ~ 85°C
Package : 107-ball FBGA Type
10.5x13mm, 0.8mm pitch <NAND>
Power Supply Voltage : 2.4~2.9V
Organization
Memory Cell Array : (32M + 1024K)bit x 8bit
Data Register : (512 + 16)bit x 8bit
Automatic Program and Erase
Page Program : (512 + 16)Byte
Block Erase : (16K + 512)Byte

Related Samsung Electronics Datasheets

Part Number	Description
K5D5657ACM-F015	MCP / 256Mb NAND and 256Mb Mobile SDRAM

K5D5657DCM-F015 Description

The K5D5657DCM is a Multi Chip Package Memory which bines 256Mbit Nand Flash Memory and 256Mbit synchronous high data rate Dynamic RAM. 256Mbit NAND Flash memory is organized as 32M x8 bits and 256Mbit SDRAM is organized as 4M x16 bits x4 banks. In 256Mbit NAND Flash, a 528-Byte page program can be typically achieved within 200.