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K4H561638F-TCC4 Datasheet

Manufacturer: Samsung Semiconductor
K4H561638F-TCC4 datasheet preview

K4H561638F-TCC4 Details

Part number K4H561638F-TCC4
Datasheet K4H561638F-TCC4 K4H560838F-TC Datasheet (PDF)
File Size 171.18 KB
Manufacturer Samsung Semiconductor
Description 256Mb F-die DDR400 SDRAM Specification
K4H561638F-TCC4 page 2 K4H561638F-TCC4 page 3

K4H561638F-TCC4 Overview

Row & Column address configuration Rev. 2003 DDR SDRAM 256Mb F-die (x8, x16) Package Physical Demension DDR SDRAM Units : 15 ) 0.05 MIN [ 0.075 MAX ] (10×) NOTE.

K4H561638F-TCC4 Key Features

  • 200MHz Clock, 400Mbps data rate
  • VDD= +2.6V + 0.10V, VDDQ= +2.6V + 0.10V
  • Double-data-rate architecture; two data transfers per clock cycle
  • Bidirectional data strobe(DQS)
  • Four banks operation
  • Differential clock inputs(CK and CK)
  • DLL aligns DQ and DQS transition with CK transition
  • MRS cycle with address key programs -. Read latency 3 (clock) for DDR400 , 2.5 (clock) for DDR333 -. Burst length (2, 4,
  • All inputs except data & DM are sampled at the positive going edge of the system clock(CK)
  • Data I/O transactions on both edges of data strobe

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