Samsung semiconductor K4T1G084QC
1Gb C-die DDR2 SDRAM Specification
FEATURES
................................................................................................................................. 4 3.0 Package Pinout/Mechanical Dimension & Addressing ............................................................ 5 3.1 x4 package pinout (Top View) : 60ball FBGA Package ....................................................................... 5 3.2 x8 package pinout (Top View) : 60ball FBGA Package ....................................................................... 6 3.3 FBGA Package Dimension(x4/x8) ................................................................................................... 7 4.0 Input/Output FunctionalDESCRIPTION
.......................................................................................... 8 5.0 DDR2 SDRAM Addressing .......................................................................................................... 9 6.0 Absolute Maximum DC Ratings ................................................................................................