Overview: K524G2GACB-A050 MCP MEMORY MCP Specification
4Gb NAND Flash + 2Gb Mobile DDR INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office. 2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could result in loss of life or personal or physical harm, or any military or .. defense application, or any governmental procurement to which special terms or provisions may apply. * Samsung Electronics reserves the right to change products or specification without notice. -1- Revision 1.3 November 2009 K524G2GACB-A050 Document Title
Multi-Chip Package MEMORY
4Gb (256M x16) NAND Flash Memory / 2Gb (64M x32) Mobile DDR SDRAM MCP MEMORY 1. Revision History
Revision No.
0.0 History
Initial issue. - 4Gb NAND Flash W-die_ Ver 0.0 - 2Gb M-DDR SDRAM B-die_Ver 1.0 Draft Date
May. 8, 2009 Remark
Preliminary 1.0 _Ver 1.0 - Corrected Errata - ECC requirement updated - Final issue _Ver 1.2 Ver 1.1 - Corrected errata. Ver 1.2 - Finalized. - Finalized Aug. 17, 2009 Final 1.1 _Ver 1.01 1. ECC requirement updated Sep. 03, 2009 Final 1.2 _Ver 1.1 1. ECC requirement updated 2. Chapter 3.10 : Updated note for Random data input _Ver 1.3 Oct. 8, 2009 Final 1.3 - Added DDR333. Nov. 26, 2009 Final ..
