K7D321874A Overview
1Mx36 & 2Mx18 SRAM 32Mb A-die DDR SRAM Specification 153FCBGA with Pb & Pb-Free (RoHS pliant) INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS...
K7D321874A Key Features
- In REENDED DC OPERATING CONDITIONS : Max VDDQ : 1.6 -> 1.9 Change TRUTH TABLE : Remove Clock Stop Change DC CHARACTERIST
- ISB1 : 150 -> 200 Change PIN CAPACITANCE : CIN : 3.1 -> 3.2, COUT : 4 -> 4.2 Change AC TIMING CHARACTERISTICS
- MIN tKHKL, tKHKL : -40 : 1.1 -> 1.2, -30 : 1.1 -> 1.4
- MIN tAVKH, tBVKH, tKHAX, tKHBX : -45 : 0.25 -> 0.27
- tKXCV MIN/MAX : 0.8/2.3 -> 1.0/2.5 Change PACKAGE THERMAL CHARACTERISTICS Feb. 2003 Advance Draft Data Dec. 2002 Jan. 20
K7D321874A Applications
- Samsung Electronics reserves the right to change products or specification without notice
