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M470T3354CZx Datasheet Ddr2 Unbuffered Sodimm 200pin Unbuffered Sodimm

Manufacturer: Samsung Semiconductor

Overview: 256MB, 512MB, 1GB Unbuffered SODIMMs DDR2 SDRAM DDR2 Unbuffered SODIMM 200pin Unbuffered SODIMM based on 512Mb C-die 64bit Non-ECC INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND. 1. For updates or additional information about Samsung products, contact your nearest Samsung office. 2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure couldresult in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. * Samsung Electronics reserves the right to change products or specification without notice. Rev. 1.2 Aug. 2005 256MB, 512MB, 1GB Unbuffered SODIMMs DDR2 Unbuffered SODIMM Ordering Information Part Number M470T3354CZ3-C(L)E7/E6/D5/CC M470T3354CZ0-C(L)E7/E6/D5/CC M470T6554CZ3-C(L)E7/E6/D5/CC M470T6554CZ0-C(L)E7/E6/D5/CC M470T2953CZ3-C(L)E7/E6/D5/CC M470T2953CZ0-C(L)E7/E6/D5/CC Density 256MB 256MB 512MB 512MB 1GB 1GB Organization 32Mx64 32Mx64 64Mx64 64Mx64 128Mx64 128Mx64 ponent position 32Mx16(K4T51163QC)*4 32Mx16(K4T51163QC)*4 32Mx16(K4T51163QC)*8 32Mx16(K4T51163QC)*8 64Mx8(K4T51083QC)*16 64Mx8(K4T51083QC)*16 DDR2 SDRAM Number of Rank 1 1 2 2 2 2 Height 30mm 30mm 30mm 30mm 30mm 30mm Note: “Z” of Part number(11th digit) stand for Lead-free products. Note: “3” of Part number(12th digit) stand for Dummy Pad PCB products.

Key Features

  • Performance range E7 (DDR2-800) Speed@CL3 Speed@CL4 Speed@CL5 CL-tRCD-tRP 400 533 800 5-5-5 E6 (DDR2-667) 400 533 667 5-5-5 D5 (DDR2-533) 400 533 533 4-4-4 CC (DDR2-400) 400 400 3-3-3 Unit Mbps Mbps Mbps CK.
  • JEDEC standard 1.8V ± 0.1V Power Supply.
  • VDDQ = 1.8V ± 0.1V.
  • 200 MHz fCK for 400Mb/sec/pin, 267MHz fCK for 533Mb/sec/pin, 333MHz fCK for 667Mb/sec/pin, 400MHz fCK for 800Mb/sec/pin.
  • 4 Banks.
  • Posted CAS.
  • Programmable CAS Latency.

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