| Part number | MR16R0824BN1 |
|---|---|
| Datasheet | MR16R0824BN1_Samsungsemiconductor.pdf |
| File Size | 37.77 KB |
| Manufacturer | Samsung Semiconductor |
| Description | (MR16R0824(6/8/C/G)BN1) RAMBUS MODULE |
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SERIAL PRESENCE DETECT MR16R0824(6/8/C/G)BN1 RAMBUS MODULE RIMM SPD Specification based on 128M RDRAM(B-die, 32s banks) Version 1.1 October 2000 Change History Version 1.1 (Oct. ′00) Based on the Samsung 128M RDRAM (A-die) SPD Specification 1.02 version. 2000 SERIAL PRESENCE DETECT MR16R0824(6/8)BN1-CK8/CK7/CG6.
See all Samsung Semiconductor datasheets
| Part Number | Description |
|---|---|
| MR16R0826BN1 | (MR16R0824(6/8/C/G)BN1) RAMBUS MODULE |
| MR16R0828BN1 | (MR16R0824(6/8/C/G)BN1) RAMBUS MODULE |
| MR16R082CBN1 | (MR16R0824(6/8/C/G)BN1) RAMBUS MODULE |
| MR16R082GBN1 | (MR16R0824(6/8/C/G)BN1) RAMBUS MODULE |
| MR16R1622AF0 | (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die |
| MR16R1622DF0 | (MR1xR1622(4/8/G)DF0) Key Timing Parameters |
| MR16R1624AF0 | (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die |
| MR16R1624DF0 | (MR1xR1622(4/8/G)DF0) Key Timing Parameters |
| MR16R1624DF0 | (MR1xR1622(4/8/G)DF0) Key Timing Parameters |
| MR16R1624GEG0 | Key Timing Parameters |
