• Part: MR16R162GDF0
  • Description: DF0) Key Timing Parameters
  • Manufacturer: Samsung Semiconductor
  • Size: 442.47 KB
MR16R162GDF0 Datasheet (PDF) Download
Samsung Semiconductor
MR16R162GDF0

Key Features

  • High speed up to 1066 MHz RDRAM storage
  • 184 edge connector pads with 1mm pad spacing
  • Module PCB size : 133.35mm x 31.75mm x 1.27mm
  • Module PCB size : 133.35mm x 34.93mm x 1.27mm (5.25” x 1.375” x 0.05”) - 256Mb and 288Mb base PC1066 RIMM Module
  • Gold plated edge connector pad contacts
  • Serial Presence Detect(SPD) support
  • Operates from a 2.5 volt supply (±5%)
  • Powerdown self refresh modes
  • Separate Row and Column buses for higher efficiency
  • WBGA package (92 balls)