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MR18R1628GEG0

Manufacturer: Samsung Semiconductor

MR18R1628GEG0 datasheet by Samsung Semiconductor.

MR18R1628GEG0 datasheet preview

MR18R1628GEG0 Datasheet Details

Part number MR18R1628GEG0
Datasheet MR18R1628GEG0 MR18R1624GEG0 Datasheet (PDF)
File Size 485.61 KB
Manufacturer Samsung Semiconductor
Description Key Timing Parameters
MR18R1628GEG0 page 2 MR18R1628GEG0 page 3

MR18R1628GEG0 Overview

MR16R1624(8/G)EG0 MR18R1624(8/G)EG0 Change History Version 0.1 (December 2003) - Preliminary First copy. (July 2002) 256/288Mbit D-die RIMM Module Datasheet .. and low latency are required.

MR18R1628GEG0 Key Features

  • High speed up to 1066 MHz RDRAM storage
  • 184 edge connector pads with 1mm pad spacing
  • Module PCB size : 133.35mm x 31.75mm x 1.27mm
  • 256Mb and 288Mb base PC800 RIMM Module
  • Module PCB size : 133.35mm x 34.93mm x 1.27mm (5.25” x 1.375” x 0.05”)
  • 256Mb and 288Mb base PC1066 RIMM Module
  • Gold plated edge connector pad contacts
  • Serial Presence Detect(SPD) support
  • Operates from a 2.5 volt supply (±5%)
  • Powerdown self refresh modes

MR18R1628GEG0 Distributor

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