• Part: CIM10F470
  • Description: Chip Bead
  • Manufacturer: Samsung Semiconductor
  • Size: 750.18 KB
Download CIM10F470 Datasheet PDF
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Datasheet Summary

Chip Bead For EMI Suppression CIB/CIM10 Series (1608/ EIA 0603) APPLICATION High frequency EMI prevention application to puters, printers, VCRs, TVs and mobile phones. Features - Perfect shape for automatic mounting, with no directionality. - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for high reliability - Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. DIMENSION REMENDED LAND PATTERN 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm Type Dimension [mm] LW t d 10 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 DESCRIPTION Part no. CIB10P100 CIB10P220...