Datasheet4U Logo Datasheet4U.com
Samsung Semiconductor logo

CIM10F471

CIM10F471 is Chip Bead manufactured by Samsung Semiconductor.
CIM10F471 datasheet preview

CIM10F471 Details

Part number CIM10F471
Datasheet CIM10F471 / CIB Datasheet PDF (Download)
File Size 750.18 KB
Manufacturer Samsung Semiconductor
Description Chip Bead
CIM10F471 page 2 CIM10F471 page 3

CIM10F471 Overview

Multi-layer type B:Mono-layer type (3) Dimension (4) Material Code (5) Nominal impedance (121:120Ω, 202:2000Ω ) (6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) (7) Packaging(C:paper tape, E:embossed tape) REMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Card Board Taping Quantity(pcs/reel) 4000 NOTICE :All specifications are subject to change...

CIM10F471 Key Features

  • Perfect shape for automatic mounting, with no directionality
  • Excellent solderability and high heat resistance for either flow or
  • Monolithic inorganic material construction for high reliability
  • Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs
  • NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or

CIM10F471 Distributor

More datasheets by Samsung Semiconductor

See all Samsung Semiconductor parts

Datasheet4U Logo
Since 2006. D4U Semicon. About Datasheet4U Contact Us Privacy Policy Purchase of parts