Datasheet4U Logo Datasheet4U.com

CIM10F471 - Chip Bead

Download the CIM10F471 datasheet PDF. This datasheet also covers the CIB variant, as both devices belong to the same chip bead family and are provided as variant models within a single manufacturer datasheet.

General Description

Part no.

Key Features

  • Perfect shape for automatic mounting, with no directionality.
  • Excellent solderability and high heat resistance for either flow or reflow soldering.
  • Monolithic inorganic material construction for high reliability.
  • Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (CIB-10P100.pdf) that lists specifications for multiple related part numbers.

Other Datasheets by Samsung Semiconductor

Part Number Description
CIM10F470 Chip Bead
CIM10F121 Chip Bead
CIM10F331 Chip Bead
CIM10F600 Chip Bead
CIM10J102 Chip Bead
CIM10J102 Chip Bead
CIM10J121 Chip Bead
CIM10J121 Chip Bead
CIM10J151 Chip Bead
CIM10J151 Chip Bead

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Chip Bead For EMI Suppression 201208 CIB/CIM10 Series (1608/ EIA 0603) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES  Perfect shape for automatic mounting, with no directionality.  Excellent solderability and high heat resistance for either flow or reflow soldering  Monolithic inorganic material construction for high reliability  Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. DIMENSION RECOMMENDED LAND PATTERN 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm Type Dimension [mm] LW t d 10 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 DESCRIPTION Part no.