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CIM10J241

CIM10J241 is Chip Bead manufactured by Samsung Semiconductor.
CIM10J241 datasheet preview

CIM10J241 Datasheet

Part number CIM10J241
Download CIM10J241 Datasheet PDF
File Size 697.16 KB
Manufacturer Samsung Semiconductor
Description Chip Bead
CIM10J241 page 2 CIM10J241 page 3

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Samsung Semiconductor datasheets

CIM10J241 Description

The first 2 digits are showing figures and the other one is for the number of zero. IMPEDANCE 60 X 101 = 600 Ω 10 X 100 = 10 Ω 6 THICKNESS OPTION t CODE N A B V Standard thickness Thinner than standard thickness Thicker than standard thickness Internally vertical electrode structure DESCRIPTION OF CODE 7 PACKAGE TYPE CODE C E Paper taping type DESCRIPTION OF CODE Embossed (Plastic) taping type CIB/CIM Series.

CIM10J241 Key Features

  • Smallest inductors suitable for surface mounting
  • Perfect shape for automatic mounting, with no directionality
  • Excellent solderability and high heat resistance for either flow or reflow soldering
  • Monolithic inorganic material construction for high reliability
  • Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs

CIM10J241 Applications

  • High frequency EMI prevention application applicable to puters, printers, VCRs, TVs and 9 portable telephones
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