2SA2151
Overview
▪ Small package (TO-3P) By adapting the Sanken unique wafer-thinner technique, these ▪ High power handling capacity, 160 W PNP power transistors achieve power-up by decreasing thermal ▪ Improved sound output by reduced on-chip impedance resistance, and provide higher voltage avalanche breakdown ▪ For professional audio (PA) applications, VCEO = -200 V rating. The high power-handling capacity of the TO-3P package versions available ▪ Complementary to 2SC6011 ▪ Recommended output driver: 2SA1668 Package: 3-Lead TO-3P allows a smaller footprint on the circuit board design.
