Datasheet4U Logo Datasheet4U.com

FH104 - High-Frequency Low-Noise Amplifier/ Differential Amplifier Applications

Datasheet Summary

Features

  • Composite type with 2 transistors contained in the MCP package currently in use, improving the mounting efficiency greatly.
  • The FH104 is formed with two chips equivalent to the 2SC4853 placed in one package.
  • Excellent in thermal equilibrium and pair capability. Electrical Connection B1 B2 E2 1 2 0.65 2.0 3 0.2 0.425 Package Dimensions unit:mm 2149 [FH104] 0.425 0.15 6 5 4 1.25 2.1 0 to 0.1 C1 E1 C2 Specifications Absolute Maximum Ratings at Ta = 25˚C Parameter Collect.

📥 Download Datasheet

Datasheet preview – FH104

Datasheet Details

Part number FH104
Manufacturer Sanyo Semicon Device
File Size 49.47 KB
Description High-Frequency Low-Noise Amplifier/ Differential Amplifier Applications
Datasheet download datasheet FH104 Datasheet
Additional preview pages of the FH104 datasheet.

📁 Similar Datasheet

  • FH101 - High Dynamic Range FET (WJ Communications)
  • FH101 - GaAs MESFET (TriQuint Semiconductor)
  • FH101-G - High Dynamic Range FET (TriQuint Semiconductor)
  • FH1011 - LED (Stanley)
  • FH102A - RF Transistor (ON Semiconductor)
  • FH105A - RF Transistor (ON Semiconductor)
  • FH1 - High Dynamic Range FET (WJ Communication)
  • FH1100 - SILICON DIODE (Advanced Semiconductor)
  • FH1117S - 1A Low Dropout Positive Regulator (Fenghua Advanced Technology)
  • FH1N4001 - General Purpose Rectifier (FH)
Other Datasheets by Sanyo Semicon Device
  • FH102 - High-Frequency Low-Noise Amp/ Differential Amp Applications
  • FH103 - High-Frequency Low-Noise Amplifier/ Differential Amplifier Applications
  • FH105 - High-Frequency Low-Noise Amplifier/ Differential Amplifier Applications

Full PDF Text Transcription

Click to expand full text
Ordering number:ENN6218 NPN Epitaxial Planar Silicon Composite Transistor FH104 High-Frequency Low-Noise Amplifier, Differential Amplifier Applications Features · Composite type with 2 transistors contained in the MCP package currently in use, improving the mounting efficiency greatly. · The FH104 is formed with two chips equivalent to the 2SC4853 placed in one package. · Excellent in thermal equilibrium and pair capability. Electrical Connection B1 B2 E2 1 2 0.65 2.0 3 0.2 0.425 Package Dimensions unit:mm 2149 [FH104] 0.425 0.15 6 5 4 1.25 2.1 0 to 0.
Published: |