ISB-A27-0 Datasheet | SANYO

Overview The ISB-A27-0 is a SANYO’S original SIP (System In Package) IC that includes four N-channel MOSFET devices. They are mounted into one thin-and-small package by utilizing SANYO’s high-density mounting technology, “Integrated System in Board (ISB)”. The advantage using its ultrathin miniature package makes the ISB-A27-0 ideal for switching devices in small, lowpower circuits for cell phones and other portable equipment. It achieves significant reduction in the ponent mounting area pared to discrete device implementations (approx 25% smaller than ECSP package). Features - Includes 4 identical N-channel MOSFET devices in a single package. - 1.6 mm×1.6 mm×0.75 mm ultrathin, miniature package. - 2.5V drive capability. Specifications Absolute Maximum Ratings at Ta = 25°C Parameter Symbol Conditions Drain-to-source voltage Gate-to-source voltage Drain current Allowable power dissipation VDSS VGSS ID Pd max mon to TR1, TR2, TR3, and TR4 When mounted on a specified board - Operating ambient temperature Topr Storage ambient temperature Tstg - Specified board: 40mm×25mm×0.8mm FR4 board Ratings 30 ±10 0.15 0.33 -30 to +85 -40 to +125 Unit V V A W °C °C - ISB is a registered trademark of SANYO Electric Co., Ltd. Any and all SANYO Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your SANYO Semiconductor representative nearest you before using any SANYO Semiconductor products described or contained herein in such applications. SANYO Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in...