SMG2329P Description
The miniature surface mount MOSFETs utilize a high cell density trench process To provide low RDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC converters and power management in portable and battery-powered products such as puters, printers, PCMCIA cards, cellular and cordless telephones.
SMG2329P Key Features
- Low RDS(on) provides higher efficiency and extends battery life
- Low thermal impedance copper leadframe SC-59 saves board
- Fast switching speed
- High performance trench technology
- 2.5 -2.0
SMG2329P Applications
- Low RDS(on) provides higher efficiency and extends battery life