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SQ2222A - Chip Type 2C2222A Geometry 0400 Polarity NPN

Key Features

  • Medium power ratings Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 24 kÅ min. Au - 6.5 kÅ nom. 4.0 mils x 4.0 mils 4.0 mils x 4.0 mils 8 mils nominal 20 mils x 20 mils Silox Passivated Electrical Characteristics TA = 25oC Parameter BVCEO BVCBO BVEBO ICBO Test conditions IC = 10 mA, IB = 0 IC = 10 µA, IE = 0 IE = 10 µA, IC = 0 VCB = 50 V, IE = 0 Min 40 75 6.0 --- Max ------10 Unit V dc V dc V dc nA dc hFE IC = 1.

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Datasheet Details

Part number SQ2222A
Manufacturer Semicoa Semiconductor
File Size 29.63 KB
Description Chip Type 2C2222A Geometry 0400 Polarity NPN
Datasheet download datasheet SQ2222A Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Data Sheet No. 2C2222A Chip Type 2C2222A Geometry 0400 Polarity NPN Generic Packaged Parts: 2N2219, 2N2219A, 2N2222, 2N2222A Chip type 2C2222A by Semicoa Semiconductors provides performance similar to these devices. Part Numbers: 2N2222A, 2N2222, 2N2219, 2N2219A, 2N2219AL, 2N2222AUB, SD2222A, SD2222AF, SQ2222A, SQ2222AF, 2N5582, 2N6989, 2N6990 Product Summary: APPLICATIONS: Designed for general purpose switching and amplifier applications. Features: Medium power ratings Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 24 kÅ min. Au - 6.5 kÅ nom. 4.0 mils x 4.0 mils 4.0 mils x 4.