Datasheet4U Logo Datasheet4U.com

SQ2222AF - Chip Type 2C2222A Geometry 0400 Polarity NPN

Key Features

  • Medium power ratings Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 24 kÅ min. Au - 6.5 kÅ nom. 4.0 mils x 4.0 mils 4.0 mils x 4.0 mils 8 mils nominal 20 mils x 20 mils Silox Passivated Electrical Characteristics TA = 25oC Parameter BVCEO BVCBO BVEBO ICBO Test conditions IC = 10 mA, IB = 0 IC = 10 µA, IE = 0 IE = 10 µA, IC = 0 VCB = 50 V, IE = 0 Min 40 75 6.0 --- Max ------10 Unit V dc V dc V dc nA dc hFE IC = 1.

📥 Download Datasheet

Datasheet Details

Part number SQ2222AF
Manufacturer Semicoa Semiconductor
File Size 29.63 KB
Description Chip Type 2C2222A Geometry 0400 Polarity NPN
Datasheet download datasheet SQ2222AF Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
SQ201 SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR Polyfet RF Devices
SQ202 SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR Polyfet RF Devices
SQ2301CES Automotive P-Channel MOSFET Vishay
SQ2301ES Automotive P-Channel MOSFET Vishay
SQ2303ES Automotive P-Channel MOSFET Vishay

Other Datasheets by Semicoa Semiconductor

Part Number Description
SQ2222A Chip Type 2C2222A Geometry 0400 Polarity NPN
SQ2857 Chip Type 2C2857 Geometry 0011 Polarity NPN
SQ2857F Chip Type 2C2857 Geometry 0011 Polarity NPN
SQ2904A Chip Type 2C2904A Geometry 0600 Polarity PNP
SQ2904AF Chip Type 2C2904A Geometry 0600 Polarity PNP

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Data Sheet No. 2C2222A Chip Type 2C2222A Geometry 0400 Polarity NPN Generic Packaged Parts: 2N2219, 2N2219A, 2N2222, 2N2222A Chip type 2C2222A by Semicoa Semiconductors provides performance similar to these devices. Part Numbers: 2N2222A, 2N2222, 2N2219, 2N2219A, 2N2219AL, 2N2222AUB, SD2222A, SD2222AF, SQ2222A, SQ2222AF, 2N5582, 2N6989, 2N6990 Product Summary: APPLICATIONS: Designed for general purpose switching and amplifier applications. Features: Medium power ratings Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 24 kÅ min. Au - 6.5 kÅ nom. 4.0 mils x 4.0 mils 4.0 mils x 4.