SKiM606GD066HD Datasheet | Semikron Danfoss

SKi M606GD066HD SKi M® 63 Trench IGBT Modules SKi M606GD066HD Features - IGBT 3 Trench Gate Technology - Solderless sinter technology - VCE(sat) with positive temperature coefficient - Low inductance case - Insulated by Al2O3 DCB (Direct Copper Bonded) ceramic substrate - Pressure contact technology for thermal contacts - Spring contact system to attach driver PCB to the control terminals - High short circuit capability, self limiting to 6 x IC - Integrated temperature sensor Typical Applications- - Automotive inverter - High reliability AC inverter wind - High reliability AC inverter drives Remarks - Case temperature limited to Ts = 125°C max; Tc = Ts (for baseplateless modules) - Remended Top = -40 …...