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SEMiX305TMLI17E4C - IGBT

Key Features

  • Solderless assembling solution with PressFIT signal pins and screw power terminals.
  • IGBT 4 Trench Gate Technology.
  • VCE(sat) with positive temperature coefficient.
  • Low inductance case.
  • Reliable mechanical design with injection moulded terminals and reliable internal connections.
  • UL recognized file no. E63532.
  • NTC temperature sensor inside Remarks.
  • Case temperature limited to TC=125°C max.
  • Product reliability r.

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SEMiX305TMLI17E4C SEMiX® 5 3-Level TNPC IGBT-Module Engineering Sample SEMiX305TMLI17E4C Target Data Features • Solderless assembling solution with PressFIT signal pins and screw power terminals • IGBT 4 Trench Gate Technology • VCE(sat) with positive temperature coefficient • Low inductance case • Reliable mechanical design with injection moulded terminals and reliable internal connections • UL recognized file no. E63532 • NTC temperature sensor inside Remarks* • Case temperature limited to TC=125°C max.