SNM005N04FH Datasheet | Semiware Semiconductor

FEATURES Surface-mounted package Low Thermal Resistance APPLICATION Motor drivers DC - DC Converter APPROVALS Ro HS pliance with 2011/65/EU HF pliance with IEC61249-2-21:2003 ABSOLUTE MAXIMUM RATINGS Parameter Drain-Source Voltage TC=25°C Drain Current ( Pulsed ) TC=25°C VGS=10V Drain Current ( DC ) TC=25°C VGS=10V TC=100°C VGS=10V Gate-Source Voltage TC=25°C Total Power Dissipation TC=25°C Diode Forward Current TC=25°C Junction Temperature Storage Temperature Single Pulsed Avalanche Energy VDD= 40 V,L=1m H Thermal Resistance ‒Junction to Ambient Thermal Resistance- Junction to Case Notes： - Surface Mounted on 1 in2 pad area, t ≤10 sec - - Pulse width ≤300μs, duty cycle≤1 % - - - Limited by bonding wire Symbol VDS I - ,- - DM - ,- - - VGS P- tot IS TJ TSTG EAS- R- θJA R- θJC N-Channel MOSFET LFPAK5×6 Schematic...