GP1S092HCPIF Description
GP1S092HCPIF is a pact-package, phototransistor output, transmissive photointerrupter, with opposing emitter and detector in a molding that provides non-contact sensing. The pact package series is a result of unique technology bing transfer and injection molding. This surface mount device has a shaped positioning pin to assure accurate PCB placement, of the emitter and detector.
GP1S092HCPIF Key Features
- pact Size
- Positioning Pin “D” shaped to prevent misalignment
- Surface Mount Type (SMT)
- Tape and Reel (T&R) 2 000 pcs per reel 3. Key Parameters
- Gap Width : 2mm
- Slit Width (detector side): 0.3mm
- Package : 4.5×2.6×2.9 mm 4. Lead free and RoHS directive pliant
- Internal Connection Diagram
- Outline Dimensions
- Unspecified tolerance shall be ± 0.2mm