GP1S25J0000F Overview
GP1S25J0000F is a pact-package, phototransistor output, transmissive photointerrupter, with opposing emitter and detector in a molding that provides noncontact sensing. The pact package series is a result of unique technology bing transfer and injection molding. This device has two positioning pins, right angle package, and is reflow solderable. ■ Agency approvals/pliance 1. pliant with RoHS directive ■
GP1S25J0000F Key Features
- Internal Connection Diagram
- Outline Dimensions
- Tolerance : ± 0.2 mm - ( ) : In dimensions for reference - The dimensions indicated by ∗ refer to those measured from th
GP1S25J0000F Applications
- Features
- Internal Connection Diagram
- Outline Dimensions
- Tolerance : ± 0.2 mm - ( ) : In dimensions for reference - The dimensions indicated by ∗ refer to those measured from th