GP1S25J0000F Description
GP1S25J0000F is a pact-package, phototransistor output, transmissive photointerrupter, with opposing emitter and detector in a molding that provides noncontact sensing. The pact package series is a result of unique technology bing transfer and injection molding. This device has two positioning pins, right angle package, and is reflow solderable.
GP1S25J0000F Key Features
- pact Size
- Positioning Pin
- Surface Mount Type (SMT)
- Sideling terminal 3. Key Parameters
- Gap Width: 1.6mm
- Slit Width (detector side): 0.3mm
- Package: 3.85×3.4×5.2mm 4. Lead free and RoHS directive pliant
- Internal Connection Diagram
- Outline Dimensions
- Tolerance : ± 0.2 mm