SSM4226GM Datasheet | Silicon Storage Technology

Description D1 D2 Advanced Power MOSFETs from Silicon Standard provide the designer with the best bination of fast switching, ruggedized device design, ultra low on-resistance and cost-effectiveness. G1 S1 G2 S2 This device is available with Pb-free lead finish (second-level interconnect) as SSM4226GM. Absolute Maximum Ratings Symbol VDS VGS ID @ TA=25°C ID @ TA=70°C IDM PD @ TA=25°C TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current 1 3 3 Rating 30 ± 20 8.2 6.7 30 2 0.016 -55 to 150 -55 to 150 Units V V A A A W W/°C °C °C Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range Thermal Data Symbol Rthj-a Parameter Thermal Resistance Junction-ambient Value Max. 62.5 Unit °C/W 8/06/2004 Rev.1.02 .Silicon Standard. 1 of 4 SSM4226M/GM Electrical Characteristics @ Tj=25o C (unless otherwise specified) Symbol BVDSS Parameter Drain-Source Breakdown Voltage Test Conditions VGS=0V, ID=250u A Min. 30 1 Typ. 0.03 15 20 5 12 12 8 31 12 320 230 Max. Units 18 28 3 1 25 ±100 30 V V/°C mΩ mΩ V S u A u A n A n C n C n C ns ns ns ns p F p F p F ∆ B VDSS/∆ Tj RDS(ON) Breakdown Voltage Temperature Coefficient Reference to 25°C, ID=1m A Static Drain-Source On-Resistance 2 VGS=10V, ID=6A VGS=4.5V, ID=4A VGS(th) gfs DSS .. Gate Threshold Voltage Forward Transconductance Drain-Source Leakage Current (Tj=25 C) Drain-Source Leakage Current (Tj=70 C) o o VDS=VGS, ID=250u A VDS=10V, ID=6A VDS=30V, VGS=0V VDS=24V ,VGS=0V VGS= ± 20V ID=8A VDS=24V VGS=4.5V VDS=15V ID=1A RG=3.3Ω ,VGS=10V RD=15Ω VGS=0V VDS=25V f=1.0MHz IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Gate-Source Leakage Total Gate Charge Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer...