SMS015N10J7 Datasheet | Silikron

Features and Benefits: - Advanced MOSFET process technology - Special designed for PWM, load switching and general purpose applications - Ultra low on-resistance with low gate charge - Fast switching and reverse body recovery - 150℃ operating temperature Pin Assignments Schematic Diagram Description : It utilizes the latest processing techniques to achieve the high cell density and reduces the on-resistance with high repetitive avalanche rating. These features bine to make this design an extremely efficient and reliable device for use in power switching application and a wide variety of other applications. Absolute Max Rating: Symbol ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C VDS VGS TJ TSTG Parameter Continuous Drain Current, VGS @ 10V ① Continuous Drain Current, VGS @ 10V ① Pulsed Drain Current ② Power Dissipation ③ Drain-Source Voltage Gate-to-Source Voltage Operating Junction and Storage Temperature Range Max. 60 39 240 104 150 ± 20 -55 to +150 Units W V V °C ©Silikron Microelectronics (Suzhou) Co.,Ltd .silikron. Version: Preliminary page 1 of 5 Thermal Resistance Symbol RθJC Characterizes Junction-to-case ③ Typ. - Max. 1.2 Units °C/W Electrical Characteristics @TA=25°C unless otherwise specified Symbol V(BR)DSS RDS(on) VGS(th) IDSS IGSS Ciss Coss Crss Qg Qgs Qgd td(on) tr td(off) tf Parameter Drain-to-Source breakdown voltage Static Drain-to-Source on-resistance Gate threshold voltage Drain-to-Source leakage current Gate-to-Source forward leakage Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-to-Source charge Gate-to-Drain("Miller") charge Turn-on delay time Rise time Turn-Off delay time Fall time Min. 150 - 2.2 - - - - - - - -...