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FEATURES • InGaP HBT Technology • -52 dBc ACPR @ ±5 MHz, +27 dBm • 30.5 dB Gain • High Efficiency • Low Transistor Junction Temperature • Matched for a 50 Ω System • Low Profile Miniature Surface Mount Package;
RoHS Compliant • Multi-Carrier Capability
AWB7227
2.11 - 2.17 GHz Small-Cell Power Amplifier Module
Data Sheet
APPLICATIONS • WCDMA, HSDPA and LTE Air Interfaces
• Picocell, Femtocell, Home Nodes
• Customer Premises Equipment (CPE)
• Data Cards and Terminals
M52 Package 14 Pin 7 mm x 7 mm x 1.3 mm
Surface Mount Module
PRODUCT DESCRIPTION The AWB7227 is a fully matched, Multi-Chip-Module (MCM) designed for picocell, femtocell, and customer premises equipment (CPE) applications.