US1J Datasheet PDF

FEATURES

— — — — — — — — — — — Glass passivated chip junction For surface mounted application Low profile package Built-in strain relief Ideal for automated placement Easy pick and place Ultrafast recovery time for high efficiency Low forward voltage, low power loss High temperature soldering guaranteed: 260 ℃/10 seconds on terminals Plastic material used carries Underwriters Laboratory Classification 94V-0 Green compound with suffix "G" on packing code & prefix "G" on datecode

MECHANICAL DATA

— — — Case: Molded plastic Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Indicated by cathode band Dimensions in inches and (millimeters) Marking Diagram US1X G Y= WW = Specific Device Code = Green Compound Year = Work Week — Weight: 0.064 grams

MAXIMUM RATINGS

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ELECTRICAL CHARACTERISTICS

Rating at 25 ℃ ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Type Number...