MMDT3906 Overview
Key Features
- ULTRA-SMALL SURFACE MOUNT PACKAGE
- EPITAXIAL PLANAR DIE CONSTRUCTION
- IDEAL FOR LOW POWER AMPLIFICATION AND SWITCHING
- ALSO AVAILABLE IN LEAD FREE VERSION
- PB FREE PRODUCT ARE AVAILABLE :98.5% SN ABOVE CAN MEET ROHSENVIRONMENT SUBSTANCE DIRECTIVE REQUEST MECHANICAL DATA
- CASE：SOT-363
- TERMINALS：SOLDERABLE PER MIL-STD-202G, METHOD 208
- APPROX. WEIGHT:0.006 GRAM
- Halogen Free:MMDT3906-H . CASE：SOT-363 DIMENSIONS IN MILLIMETERS AND (INCHES)
