S5M Overview
Key Features
- LOW PROFILE PACKAGE
- PLASTIC PACKAGE HAS UNDERWRITERS LABORATORY 94V-0
- IDEAL FOR SURFACE MOUNTED APPLICATION
- GLASS PASSIVATED CHIP JUNCTION
- BULIT-IN STRAIN RELIEF DESIGN
- FAST SWITCHING FOR HIGH EFFICIENT
- HIGH TEMPERTURE SOLDERING : 260℃/10 SECONDS AT TERMINALS MECHANICAL DATA
- CASE：JEDEC DO-214AB MOLDED PLAS BODY
- TERMINAL：SOLDER PLATED, SOLDERABLE PER MIL-STD-750 METHOD 2026
- POLARITY：COLOR BAND DENOTES CATHODE
