TMOS TXY8205
Dual N-CHANNEL High Density Trench MOSFET
DESCRIPTION
FEATURES
High Density cell trench design for low Rds(on) Rugged and reliable Surface Mount package Lead Free Available(Green Product)ABSOLUTE MAXIMUM RATINGS
Symbol Parameter VDSS Drain-Source Voltage ( VGS=0V ) VGSS Gate- source Voltage ID (a) Drain Current (continuous) at TC = 25 ℃ ID Drain Current (continuous) at TC = 100 ℃ IDM (b) Drain Current (pulsed) Ptot Total Dissipation at TC = 25 ℃ Tstg Storage Temperature Tj Max. Operating Junction Temperature (a) Current limited by package (b) Pulse width limited by safe operating area THERMAL DATA Rthj-amb Thermal Resistance Junction-ambient 1 TSOP 6 / SOT 23-6 Value 20 ±12V 6 2.4 24 1.25 - 55~175 Unit V V A A A W ℃ Max 100 ℃ /W DS-Rev-1.0 TXY8205ELECTRICAL CHARACTERISTICS
(Tcase = 25 ℃ unless otherwise specified) OFF Symbol Parameter Test Conditions Min Typ Max Unit BVDSS Drain-source Breakdown Voltage ID = 250 uA , VGS = 0V 20 V IDSS Zero Gate Voltage Drain Current (VGS = 0V) VDS = 16V 1 uA IGSS Current (VDS = 0V) VGS =± 1...